Beilstein J. Nanotechnol.2019,10, 79–94, doi:10.3762/bjnano.10.8
interlocking of the softsubstrate into the holes of the terminal layer. Pull-off from soft substrates increased with the substrate stiffness for all tested geometries. Friction forces on soft substrates were the highest for microscale dimples without a terminal layer, likely due to interlocking of the soft
substrate between the dimples.
Keywords: adhesion; biomimetic micropatterned adhesive; colloidal lithography; friction; pull-off; softsubstrate; Introduction
Pull-off and friction forces of micropatterned adhesives as a function of geometry, feature size, and stiffness
Over the last few decades
off a micropattern from a softsubstrate, the substrate deforms, and the detachment of neighboring pillars is no longer independent [24]. Accordingly, the pull-off force of mushroom-pillar micropatterns on a soft elastic substrate (Young’s modulus E = 200 kPa) has been found to be lower than on a
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Figure 1:
Pathway to fabricate dimple arrays with and without terminal layers. Starting from the left: deposi...